Texas instruments breaks ground on new 300-mm semiconductor wafer fabrication plant in utah

Lehi, utah , nov. 2, 2023 /prnewswire/ -- texas instruments (ti) (nasdaq: txn) today broke ground on its new 300-mm semiconductor wafer fabrication plant (or "fab") in lehi, utah. joined by utah governor spencer cox, state and local elected officials, as well as community leaders, ti president and chief executive officer haviv ilan celebrated the first steps toward construction of the new fab, lfab2, which will connect to the company's existing 300-mm wafer fab in lehi.
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