Sk hynix partners with tsmc to strengthen hbm technological leadership

Sk hynix and tsmc sign mou to collaborate on hbm4 development and next-generation packaging technology sk hynix will adopt tsmc's cutting-edge foundry process to advance hbm4 performance product design-foundry-memory trilateral collaboration to break memory performance limits for ai applications seoul, south korea , april 18, 2024 /prnewswire/ -- sk hynix inc. (or "the company", www.skhynix.com) announced today that it has recently signed a memorandum of understanding with tsmc for collaboration to produce next-generation hbm and enhance logic and hbm integration through advanced packaging technology. the company plans to proceed with the development of hbm4, or the sixth generation of the hbm family, slated to be mass produced from 2026, through this initiative.
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