Tsmc announces breakthrough set to redefine the future of 3d ic

Santa clara, calif.--(business wire)--tsmc (tse: 2330, nyse: tsm) today announced the new 3dblox 2.0 open standard and major achievements of its open innovation platform® (oip) 3dfabric alliance at the tsmc 2023 oip ecosystem forum. the 3dblox 2.0 features early 3d ic design capability that aims to significantly boost design efficiency, while the 3dfabric alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration. tsmc continues to push the envelope of 3d i.
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