Ausdia joins tsmc open innovation platform® (oip) eda alliance

Sunnyvale, calif.--(business wire)-- #ai--ausdia, a provider of design constraints verification and management solutions, announced today its participation in the tsmc open innovation platform® (oip) electronic design automation (eda) alliance. as a new member of this prestigious ecosystem, ausdia will integrate its timevision™ platform with tsmc's process technologies, providing enhanced eda tools that help customers meet the increasing design complexity of today's semiconductor applications. the ts.
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