Unveiling the industry's first silicon-proven 3nm, 24gbps ucie™ ip subsystem with tsmc cowos® technology

London & toronto--(business wire)--alphawave semi (lse: awe), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, has unveiled the availability of the industry's first 3nm silicon-proven universal chiplet interconnect express (ucie™) die-to-die (d2d) ip subsystem, built on tsmc's chip-on-wafer-on-substrate (cowos®) advanced packaging technology. this complete phy and controller subsystem, developed in close collaboration with tsmc, is tailor.
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