Alphawave semi launches industry's first 3nm ucie ip with tsmc cowos packaging

London & toronto--(business wire)--alphawave semi (lse: awe), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, has launched the industry's first 3nm successful silicon bring-up of universal chiplet interconnect express (ucie™) die-to-die (d2d) ip with tsmc's chip-on-wafer-on-substrate (cowos®) advanced packaging technology. the complete phy and controller subsystem was developed in collaboration with tsmc and targets applications such as.
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