Synopsys collaborates with tsmc to unleash system innovation with most comprehensive multi-die design solutions for tsmc's advanced technologies

Synopsys eda and ip solutions enable new levels of integration and functionality for 2.5d/3d designs on tsmc's advanced process and 3dfabric™ technologies mountain view, calif. , oct. 26, 2022 /prnewswire/ -- addressing complex customer requirements for heterogeneous compute-intensive applications, synopsys, inc. (nasdaq:  snps ) today announced the availability of the industry's most comprehensive eda and ip solutions for 2d/2.5d/3d multi-die systems for tsmc's most advanced n7, n5 and n3 process technologies.
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