Synopsys and tsmc streamline multi-die system complexity with unified exploration-to-signoff platform and proven ucie ip on tsmc n3e process

Comprehensive multi-die system design solution supports 3dblox 2.0 standard and tsmc 3dfabrictm technologies to boost productivity for fast heterogeneous integration highlights: synopsys 3dic compiler integrates with 3dblox 2.0 standard for heterogeneous integration and a complete exploration-to-signoff solution. synopsys ucie phy ip, which achieved first-pass silicon success on tsmc n3e process, provides low-latency, low-power, and high-bandwidth die-to-die connectivity.
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