Synopsys, tsmc and ansys strengthen ecosystem collaboration to advance multi-die systems

Close collaboration addresses chip, package and system-level effects for designs on tsmc advanced technologies mountain view, calif. , april 24, 2023 /prnewswire/ -- accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, synopsys, inc. (nasdaq: snps) has strengthened its collaboration with tsmc and ansys for multi-die system design and manufacturing.
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