Synopsys expands strategic technology collaboration with tsmc to extend 3d-system integration solutions for next-generation high-performance computing designs

Mountain view, calif., oct. 20, 2021 /prnewswire/ -- highlights of this announcement: expanded strategic collaboration delivers comprehensive 3d-system integration capabilities, enabling the aggregation of hundreds of billions of transistors in a single package synopsys 3dic compiler, the unified, multi-die implementation platform, seamlessly integrates tsmc  3dfabric technologies-based design methodologies, to offer a complete exploration-to-signoff design platform this joint collaboration combines tsmc's technology advancements with the converged architecture, advanced in-design analysis framework and signoff tools of 3dic compiler to deliver the required performance, power and transistor-volume density   synopsys, inc. (nasdaq: snps) today announced it has expanded its strategic technology collaboration with tsmc to deliver the next level in system integration to address the increasingly critical performance, power and area targets for high-performance computing (hpc) applications.
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