Synopsys 3dic compiler qualified for samsung foundry's multi-die integration flow, accelerating 2.5d and 3d designs

Mountain view, calif., nov. 17, 2021 /prnewswire/ --   highlights: single, unified 3dic platform enables system-driven ppa per cubic mm silicon optimization synopsys and samsung foundry are fostering advanced-node and multi-die packaging innovation and productivity for in-demand applications such as hpc, ai, automotive and 5g to strengthen innovation of complex socs for compute-intensive applications such as high-performance computing, ai and 5g, synopsys, inc. (nasdaq: snps) today announced that its 3dic compiler unified 2.5d and 3d multi-die package co-design and co-analysis platform has been qualified for samsung foundry's multi-die integration (mdi™) flow.
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