Synopsys and tsmc pave the path for trillion-transistor ai and multi-die chip design

Optimized eda and ip solutions deliver enhanced compute performance, power and engineering productivity for tsmc n2 and a16 processes  highlights production-ready ai-driven eda flows, powered by synopsys.ai, on n2 deliver exceptional quality of results and accelerate design node migration for industry leaders developing new backside power delivery capabilities on tsmc's a16 to enable efficient power distribution and system performance joint tsmc, synopsys and ansys multi-physics flow supporting cowos interposer packaging addresses thermal and power integrity challenges synopsys 3dso.ai delivers ai-driven system analysis for maximum quality of results with support for tsmc's 3dfabric new development of 40g ucie, hbm4 and 3dio ip on advanced tsmc nodes optimizes latency, power, performance and area sunnyvale, calif. , sept. 25, 2024 /prnewswire/ -- synopsys, inc. (nasdaq: snps) today announced its continued, close collaboration with tsmc to deliver advanced eda and ip solutions on tsmc's most advanced process and 3dfabric technologies to accelerate innovation for ai and multi-die designs.
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