Synopsys accelerates chip innovation with production-ready multi-die reference flow for intel foundry

3dic compiler co-design and analysis solution combined with synopsys ip accelerates heterogeneous integration for intel foundry's emib technology highlights synopsys ai-driven multi-die reference flow now extended for intel foundry's emib advanced packaging technology accelerates quality-of-results for heterogeneous integration synopsys 3dic compiler, a unified exploration-to-signoff platform, supports multi-die co-design of intel foundry's emib technology synopsys ip for multi-die design supports efficient die-to-die connectivity and high memory bandwidth requirements sunnyvale, calif. , june 24, 2024 /prnewswire/ -- synopsys, inc. (nasdaq: snps) today announced the availability of its production-ready multi-die reference flow, powered by synopsys.ai™ eda suite, and synopsys ip for intel foundry's embedded multi-die interconnect bridge (emib) advanced packaging technology.
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