Super micro computer, inc. delivers portfolio of advanced hpc systems at sc19

Super micro computer, inc. brings broadest selection of high-performance computing (hpc) systems to supercomputing 2019 (sc19), booth #1211, in the colorado convention center from november 18-21. in addition to the demonstrations, supermicro is also hosting speaking sessions from industry leaders, including representatives from intel, nvidia, and amd. supermicro offers an extensive range of leading edge hpc systems optimized for specific software, storage, and power/cooling requirements to accelerate the deployment of complete field-proven hpc solutions. supermicro provides advanced blade systems including the latest superblade systems with one-socket, two-socket and four-socket blade servers supporting top-bin 205-watt processors, nvme, 100g edr infiniband switches, 25g/10g ethernet switches, gpu support, redundant ac/dc power supplies, and battery backup (bbp), making them ideal for enterprise, cloud, and hpc applications. critical to hpc is the high density that superblade provides (10 x 4-sockets, 20 x 2-sockets, or 20 x 1 socket blade servers delivering up to 40 cpus and up to 40 gpus in 8u). supermicro introduced its multi-node twin family to meet the density and shared power requirements of hpc environments. supermicro's new bigtwin multi-node family delivers density, shared power and full performance for hpc. the bigtwin edsff e1.s, the latest addition to the family, is a 2u four dp node system with 10 edsff (e1.s) drives per node. this system is capable of supporting up to 205w processors. also, the h12 bigtwin family of servers is optimized to deliver a new level of integration and superior performance for modern datacenters leveraging amd epyc™ 7002 series processors. customers can anticipate increased performance, double the core count of the previous generation a+ systems, and up to four times the peak gflops per socket.
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