Ranpak announces cut'it!™ evo multi-lid at modex 2024

Concord township, ohio--(business wire)--ranpak holdings corp. (“ranpak”) (nyse: pack), a global leader of environmentally sustainable, paper-based packaging solutions for e-commerce and industrial supply chains, today announced the development of cut'it!™ evo multi-lid, a solution that allows up to four distinct lids to be applied via one cut'it!™ evo machine, dramatically improving customer experience and managing multiple branded lid requirements through a single packaging line. ranpak repor.
PACK Ratings Summary
PACK Quant Ranking