Onto innovation announces growing $500 million order backlog, including solutions for heterogeneous packaging

Wilmington, mass.--(business wire)---- $onto #chiplets--onto innovation inc. (nyse: onto) (“onto innovation,” “onto,” or the “company”) today announced a total order backlog of $500 million comprised of more than $100 million for its lithography and inspection products in support of the emerging heterogeneous packaging sector, which covers technology designed for 2.5d and next-generation 3d packages and those using hybrid bonding as a method of connecting stacked chips. heterogeneous packaging is expected to be th
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