Onto innovation launches u.s. applications center of excellence focused on panel-level packaging

Wilmington, mass.--(business wire)---- $onto--onto innovation inc. (nyse: onto) today announced the launch of an applications center of excellence, a combined tool demonstrator, photo resist qualification, process integration and research and development (r&d) facility focused on panel-level packaging (plp), a key facilitator of the emerging chiplet market. the chiplet package market is expected to grow at an annual average rate of 103% over the next three years, according to techsearch international.
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