Onto innovation advances process control suite for 3d interconnect yields

Wilmington, mass.--(business wire)---- $onto--onto innovation inc. (nyse: onto) today announced advances in its product suite for 3d interconnect process control, featuring the new 3di™ technology on the dragonfly® g3 system for bump process control in high bandwidth memory (hbm) and advanced logic applications. additionally, the echoscan™ system is introduced for detecting voids as small as 1Μm in wafer bonding applications, such as advanced hybrid bonding for cu-cu interconnects. initial orders for the.
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