Onto innovation further strengthens company's panel portfolio with new glass suite

Wilmington, mass.--(business wire)---- $onto--onto innovation inc. (nyse: onto) today announced onto innovation's glass substrate suite featuring the jetstep® x500 panel-level packaging lithography system with hybrid substrate handling capabilities and the firefly® g3 sub-micron automatic metrology and inspection system for panel-level packaging and advanced ic substrates (aics). the jetstep x500 and firefly g3 systems offer customers a complete panel-level packaging solution supporting heterogeneous int.
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