Lightwave logic announces publication of u.s. patent application for breakthrough chip-scale packaging technique to enable foundry-level packaging of polymer modulators

Ability to fabricate polymer modulators using chip-scale techniques aligns the lightwave technology platform with mainstream silicon electronics chip-scale packaging, enabling simplified high-volume manufacturing through foundry-level packaging     englewood, colo. , june 23, 2022 /prnewswire/ -- lightwave logic, inc. (nasdaq: lwlg), a technology platform company leveraging its proprietary electro-optic polymers to transmit data at higher speeds with less power, today announced the publication of a u.s. patent application on a new invention that will enable simplified foundry-level packaging of polymer modulators using chip-scale techniques which can be applied at wafer level, critical for high-volume manufacturing applications.
LWLG Ratings Summary
LWLG Quant Ranking