Update -- classone technology and ibm research jointly developing non-nmp solvent processing for semiconductor manufacturing

Kalispell, mont., may 19, 2025 (globe newswire) -- classone technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has signed a joint development agreement with ibm research focused on wet processing for advanced packaging. the two companies will leverage their respective semiconductor chemistry expertise to create innovative solvent solutions for a range of advanced semiconductor and packaging process applications.
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