Rapidus and ibm expand collaboration to chiplet packaging technology for 2nm-generation semiconductors

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology tokyo , june 3, 2024 /prnewswire/ -- rapidus corporation, a manufacturer of advanced logic semiconductors, and multinational technology company ibm (nyse: ibm), today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. through this agreement, rapidus will receive packaging technology from ibm for high-performance semiconductors, and the two companies will collaborate with a goal of further innovating in this space.
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