Corning collaborates with broadcom to accelerate ai data center processing capacity

Corning, n.y.--(business wire)--corning incorporated (nyse:glw), a world leader in glass science and optical physics, today announced a collaboration with broadcom incorporated (nasdaq:avgo), a leading supplier in the semiconductor field, on a co-packaged optics (cpo) infrastructure that will significantly increase processing capacity within data centers. corning will supply cutting-edge optical components for broadcom's bailly cpo system, the industry's first cpo-based 51.2 terabit per second.
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