Ase's vipack™ enables innovational ai devices through advanced interconnect technology for chiplets

Sunnyvale, calif.--(business wire)--advanced semiconductor engineering, inc. (ase), a member of ase technology holding co., ltd. (nyse: asx) (taiex: 3711), today announced that it has extended its advanced interconnect technology under the vipack™ platform to meet the accelerating demand for complex chiplet integration for artificial intelligence (ai) applications. this interconnect extension advances roadmap capabilities from a chip-on-wafer interconnect pitch of 40um to 20um through advanced.
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