Ase vipack™ focos-bridge integrates multiple asics and silicon bridges to accelerate ai innovation

Sunnyvale, calif.--(business wire)--advanced semiconductor engineering, inc. (ase), a member of ase technology holding co., ltd. (nyse: asx, taiex: 3711), today announced its latest fan-out-chip-on-substrate-bridge (focos-bridge) technology breakthrough, achieved through qualifying a large 70mm x 78mm package that incorporates two asics and eight high bandwidth memory (hbm) devices connected through eight silicon bridges. this large package features two identical 47mm x 31mm focos-bridge fan-ou.
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