Ase drives latency and bandwidth innovation with vipack™ fanout package-on-package

Sunnyvale, calif.--(business wire)-- #vipack--advanced semiconductor engineering, inc. (ase), a member of ase technology holding co., ltd. (nyse: asx, taiex: 3711), today announced its most advanced fan-out-package-on-package (fopop) solution, developed to lower latency and deliver exceptional bandwidth advantages for the dynamic mobile and networking markets.
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