Ase introduces vipack™ to help transform packaging solution enablement

Sunnyvale, calif.--(business wire)--advanced semiconductor engineering, inc. (ase), a member of ase technology holding co., ltd. (nyse: asx, taiex: 3711), today introduced vipack™, an advanced packaging platform designed to enable vertically integrated package solutions. vipack™ represents ase's next generation of 3d heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance. the platform leverages advanced redistribution layer (rdl) process
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