Ase announces focos-bridge with tsv; latest package technology reduces power loss by 3x for next-generation ai and hpc applications

Sunnyvale, calif.--(business wire)--advanced semiconductor engineering, inc. (ase), a member of ase technology holding co., ltd. (nyse: asx, taiex: 3711), today announced fan-out chip-on-substrate-bridge (focos-bridge) with through silicon via (tsv), propelling technology enablement for artificial intelligence (ai) and its pervasive impact on global life. delivering critical performance improvements, ase's focos-bridge with tsv addresses growing demand for increased bandwidth by creating a shor.
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