Alpha and omega semiconductor announces new 60v and 100v mosfets in to-leadless packaging technology for high current applications

Alpha and omega semiconductor limited introduced the to-leadless (toll) package in combination with a 60v and 100v shield-gate technology (sgt) providing the highest current capability in its voltage class. the toll package has the highest current capacity due to aos’ innovative technology, which utilizes a clip to achieve the in-rush current. the toll packaging technology offers a very low package resistance and inductance due to the clip technology when compared to other to-leadless packages. this packaging technology uses a standard wire-bonding technology which enables improved emi performance. the aotl66608 (60v), aotl66610 (60v), and aotl66912 (100v) have a 30% smaller footprint compared to a to-263 (d2pak) package and has a higher current capability which enables the designer to reduce the number of mosfets in parallel. the new device’s offer a higher power density compared to existing solutions. they are ideally suited for industrial bldc motor applications and battery management.
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