Ansys 3d-ic power integrity and thermal solutions certified for tsmc 3dblox reference flow

Ansys redhawk-sc™ and redhawk-sc electrothermal™ are compliant with tsmc's 3dblox™ for simpler and more efficient 3d-ic implementation with tsmc 3dfabric™ technologies    / key highlights ansys® redhawk-sc™ and ansys® redhawk-sc electrothermal™ multiphysics power integrity and 3d-ic thermal integrity platforms are certified as compliant with tsmc's 3dblox standard for 3d-ic design redhawk-sc and redhawk-sc electrothermal are included in tsmc's 3dblox reference flow for power integrity and thermal reliability signoff of designs using tsmc 3dfabric technologies pittsburgh , oct. 26, 2022 /prnewswire/ -- ansys (nasdaq: anss) has collaborated with tsmc to certify that ansys redhawk-sc™ and ansys® redhawk-sc electrothermal™ are compliant with tsmc's 3dblox™ standard for the exchange of design data between different tools in a 3d-ic design flow. the tsmc 3dbloxtm standard unifies its open innovation platform® (oip) design ecosystem with qualified eda tools and flows for tsmc 3dfabrictm, the world's most comprehensive family of 3d silicon stacking and advanced packaging technologies.
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