Ansys and tsmc enable a multiphysics platform for optics and photonics, addressing needs of ai, hpc silicon systems

Collaboration on tsmc's coupe silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, hpc, and ai chips / key highlights ansys and tsmc deliver a high-fidelity multiphysics solution to address design challenges for artificial intelligence (ai), datacenter, cloud, and high-performance computing (hpc) chips the combined effort covers a broad range of ansys multiphysics simulation solutions, including semiconductor, thermal, electromagnetics, photonics, and optics   pittsburgh , april 24, 2024 /prnewswire/ -- ansys (nasdaq: anss) today announced a collaboration with tsmc on multiphysics software for tsmc's compact universal photonic engines (coupe). coupe is a cutting-edge silicon photonics (siph) integration system and co-packaged optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
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