Ansys, intel foundry collaborate on multiphysics analysis solution for emib 2.5d assembly technology

Ansys electro-thermal analysis tools address novel physics requirements for signoff verification of multi-chip hpc, graphics, and ai applications / key highlights ansys collaboration to expand from single-die system-on-chip (soc) to include intel's embedded multi-die interconnect bridge (emib) assembly technology ansys multiphysics analyses provide signoff verification of thermal integrity, power integrity, and mechanical reliability pittsburgh , feb. 22, 2024 /prnewswire/ -- ansys (nasdaq: anss) and intel foundry collaborated to provide multiphysics signoff solutions for intel's innovative 2.5d chip assembly technology, which uses emib technology to connect the die flexibly and without the need for through-silicon vias (tsvs). ansys' accurate simulation engines deliver higher speeds, lower power consumption, and greater reliability in advanced silicon systems for artificial intelligence (ai), high-performance computing, autonomous driving, and graphic processing.
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