Ansys collaborates with tsmc and microsoft to accelerate mechanical stress simulation for 3d-ic reliability in the cloud

The joint solution provides a high-speed and high-capacity cloud solution for analyzing the mechanical stresses in 2.5d/3d-ic multi-die systems, which extends product reliability / key highlights managing thermal mechanical stress is crucial for 3d-ic reliability and robustness ansys collaborated with tsmc and microsoft to enable a fast, and high-capacity solution for analyzing mechanical stresses in multi-die designs using tsmc's 3dfabric technologies ansys mechanical simulates the stresses in large, 3d integrated circuits with predictive accuracy to enable robust and reliable products pittsburgh , nov. 16, 2023 /prnewswire/ -- ansys (nasdaq: anss) has collaborated with tsmc and microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3d-ic systems manufactured with tsmc's 3dfabric™ advanced packaging technologies. this collaborative solution gives customers added confidence to address novel multiphysics requirements that improve the functional reliability of advanced designs using tsmc's 3dfabric, a comprehensive family of 3d silicon stacking and advanced packaging technologies.
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