Ansys receives four tsmc 2023 oip partner of the year awards for joint development of leading multiphysics technology and design solutions

Ansys receives four awards for joint development of advanced silicon signoff capabilities, 3d-ic prototyping, rf design, and partner collaboration / key highlights ansys secured an award in the category of joint development of 2nm and n3p design infrastructure for delivering foundry-certified, state-of-the-art power integrity and reliability signoff verification tools for tsmc's newest process technologies ansys earned an award in the category of joint development of 3dblox design prototyping solution to provide power integrity and thermal feasibility analysis for tsmc's 3dfabric advanced packaging technologies ansys earned two awards in the categories of joint development of millimeter-wave design solutions and partner collaboration for two years of collaborative effort and the delivery of four reference flows that showcase the synergy of the oip ecosystem pittsburgh , oct. 19, 2023 /prnewswire/ -- ansys (nasdaq: anss) has been recognized by tsmc as a recipient of four tsmc open innovation platform® (oip) partner of the year awards for 2023. the oip partner of the year awards honor tsmc open innovation platform ecosystem partners' pursuit of excellence in next-generation design enablement over the past year.
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