Ansys semiconductor simulation solutions certified for umc's 3d chip technology

Ansys semiconductor simulation tools are certified for umc's latest wafer-on-wafer (wow) advanced packaging technology / key highlights ansys redhawk-sc™ and ansys redhawk-sc electrothermal™ have been certified by united microelectronics corporation (umc) to simulate its latest 3d integrated circuit (3d-ic) packaging technology chip designers can leverage ansys semiconductor solutions to perform multi-die co-analysis for wow and cow packaging technology, accelerating and ensuring successful design pittsburgh , oct. 18, 2023 /prnewswire/ -- ansys (nasdaq: anss) multiphysics solutions have been certified by global semiconductor foundry umc to simulate its latest 3d-ic wow stacked technology, which will improve the power, efficiency and performance of edge ai, graphic processing, and wireless communication systems. the certification empowers more chip designers to employ ansys' semiconductor simulation solutions that perform multi-die co-analysis for streamlining and ensuring successful design.
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