Ansys simulation boosts the thermal reliability of upi's power management products by 100%

Upi leverages ansys' multiphysics simulation tools to enhance the design, development, and verification of its chip package designs / key highlights upi achieves a 2x improvement in thermal cycle endurance for their semiconductor product packages with ansys' multiphysics simulation solutions ansys' predictive simulation insights enable upi to accelerate r&d and improve electrical performance, while decreasing the risk of late-stage design changes pittsburgh , july 18, 2023 /prnewswire/ -- upi semiconductor corp. (upi) applies ansys' (nasdaq: anss) simulation solutions to speed up design for its product packaging solutions and improve thermal reliability by 2x. upi is a leading supplier of semiconductor power management chips for high-performance computing (hpc) applications, communications hardware, battery management, industrial equipment, and consumer products.
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