Samsung foundry certifies ansys thermal integrity and power integrity solutions for its multi-die packaging technologies

Ansys multiphysics platform provides proven solutions to address challenges in simulating and managing power and thermal effects for heterogeneous 2.5d/3d-ic multi-die systems / key highlights ansys® redhawk-sc™ and ansys® redhawk-sc electrothermal™ multiphysics power integrity and 3d-ic thermal integrity platform are certified for use with samsung foundry's x-cube technology for 3d packaging ansys® icepak™ used to validate the predictive accuracy of redhawk-sc electrothermal pittsburgh , june 28, 2023 /prnewswire/ -- ansys (nasdaq: anss) announces that samsung foundry has certified ansys' redhawk power integrity and thermal verification platform for samsung's family of heterogeneous multi-die packaging technologies. samsung's collaboration with ansys recognizes the critical importance of power and thermal management on the reliability and performance of advanced side-by-side (2.5d) and 3d integrated circuit (3d-ic) systems.
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