Samsung foundry certifies ansys, inc. multiphysics simulation solutions for multi-die integration advanced packaging technology

Samsung foundry certified ansys multiphysics simulation solutions for its latest multi-die integrationtm (mdi) advanced two and a half dimensional/three-dimensional integrated circuit (2.5d/3d-ic) packaging technology. the certification empowers mutual customers to achieve higher performance and lower power within a smaller form factor when designing 2.5/3d-ics for artificial intelligence (ai), 5g, automotive, networking and high-performance computing (hpc) applications. system-in-package designs — enabled by samsung mdi — are highly complex with multiple dies integrated on an interposer in a 2.5d/3d packaging configuration. mdi flow combines analysis, implementation and physical verification in a single canvas and uniquely features early-stage system-level pathfinding and complex multiphysics signoff capabilities. these designs are widely used in ai, 5g, automotive, high-speed networking and hpc applications to achieve extreme system bandwidth, low latency and high performance. ansys multiphysics simulation solutions for mdi signoff offer a complete 2.5d/3d-ic methodology for power, signal and thermal integrity and reliability analysis across the broad frequency spectrum of chip, package and board and system design to improve engineering efficiency, achieve simulation accuracy and accelerate time-to-results.
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