Ase group significantly advances semiconductor packaging development with ansys customization toolkit solution

Ase group (ase) engineers have drastically improved their integrated circuit (ic) semiconductor packaging and development process to create microchips by ansys. developing an ansys customization toolkit (act) solution, engineers create more accurate models, enhance structural reliability and slash design time to enable customers to receive products faster than ever. as ic manufacturing processes become more complex, companies have shifted focus to product design and dedicating less development time to simulation. as a result, engineers cannot capture reliability problems, optimum designs cannot be created and product reliability becomes compromised, requiring vast redesign expenses. to improve the ic packaging and development process, engineers must quickly create models that span countless scenarios to identify design problems and boost product performance. leveraging extensive process experience and best practices, ase has developed an ansys act workflow. this streamlined sub-modeling automation solution enhances the ic packaging and development process. ase's ansys act extension drastically reduces human error by converting complex manual analyses into an automatic search process to identify critical reliability issues such as cracking and interface delamination. this enables ase engineers to swiftly create highly precise models, rapidly determine the optimal solution, identify problematic parts and reduce overall development time by 30%.
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