Guc and ansys expedite advanced-ic designs for next-generation applications with state-of-the-art simulation workflow

Pittsburgh, pa., march 25, 2021 /prnewswire/ -- / key highlights guc engineers are using ansys hfss 3d layout's advanced simulation workflow to speed advanced integrated circuit (advanced-ic) design the workflow helps guc rapidly incorporate its die-to-die solution across cowos (chip-on-wafer-on-substrate), info (integrated fan-out) and interposer designs to create leading-edge artificial intelligence (ai), high-performance computing (hpc) and data center networking customer asics global unichip corporation (guc) is adopting a groundbreaking simulation workflow developed by ansys (nasdaq: anss) to accelerate advanced-ic design.
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