H3c semiconductor and ansys innovate next-generation network processor chip for high-end routing, 5g backhaul, ai and cybersecurity applications

Pittsburgh, april 14, 2021 /prnewswire/ --  / key highlights h3c semiconductor designers used ansys' comprehensive multiphysics platform — including ansys siwave, ansys hfss, and ansys redhawk-sc — to engineer a state-of-the-art network processor chip featuring 56g serdes and lpddr5 interfaces using ansys solutions, h3c semiconductor designers managed multifaceted design issues from chip design to signoff, co-simulating the chip and package to power advanced routing, 5g backhaul, artificial intelligence (ai) and cybersecurity applications h3c semiconductor leveraged ansys (nasdaq: anss) simulation solutions to launch engiant 660, a highly sophisticated network processor chip that enables routing, ai, 5g backhaul and cybersecurity applications. h3c semiconductor designers used ansys' cutting-edge multiphysics simulation platform to enhance product signoff efficiency, spur product development and pass stringent testing requirements.
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