Ansys collaborates with tsmc to deliver thermal analysis solution for 3d-ic designs

Pittsburgh, oct. 27, 2021 /prnewswire/ --  / key highlights the companies collaborated to deliver a comprehensive hierarchical thermal analysis solution for tsmc 3dfabric using redhawk-sc electrothermal tsmc enabled ansys redhawk-sc™ for power integrity (em/ir) signoff of 3dfabric designs tsmc and ansys (nasdaq: anss) collaborated to create a comprehensive thermal analysis solution for multi-die designs built with tsmc 3dfabric™, tsmc's comprehensive family of 3d silicon stacking and advanced packaging technologies. this solution is built on ansys tools to simulate the temperature of 3d and 2.5d electronic systems containing multiple chips stacked closely together using the advanced tsmc 3dfabric technologies.
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