Ansys receives 2021 tsmc oip partner of the year awards for next-generation design enablement

Pittsburgh, nov. 23, 2021 /prnewswire/ --  / key highlights ansys multiphysics signoff technology is recognized as important for classical moore's law scaling as well as for tsmc's breakthrough 2.5d/3d multi-die technologies ansys secured an award in the category of joint development of 4nm design infrastructure for delivering foundry-certified, state-of-the-art power integrity and reliability signoff verification tools for tsmc n4 process ansys earned an award in the category of joint development of 3dfabric™ design solution for providing foundry-certified thermal, power integrity, and reliability solutions for tsmc 3dfabric™, a comprehensive family of 3d silicon stacking and advanced packaging technologies ansys (nasdaq: anss) has been recognized by tsmc as a recipient of two 2021 oip partner of the year awards for joint development of 4nm design infrastructure and joint development of 3dfabric™ design solution. the partner of the year award honors tsmc open innovation platform® (oip) ecosystem partners' pursuit of excellence in next-generation design enablement over the past year.
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