Ansys and tsmc collaborate to deliver multiphysics design methodology for wireless chips

Ansys platform supports tsmc's n6rf design reference flow to help enable faster and higher performance radio frequency chips for 5g, wi-fi, and iot with tsmc's n6rf process technology / key highlights the ansys multiphysics platform supports tsmc's n6rf design reference flow for designing radio frequency (rf) chips with tsmc n6 process technology ansys solutions, including ansys® raptorx™, ansys® exalto™, ansys® velocerf™, and ansys® totem™, are enabled throughout the tsmc n6rf design reference flow from implementation to verification pittsburgh , june 24, 2022 /prnewswire/ --  ansys (nasdaq: anss) collaborated with tsmc on the tsmc n6rf design reference flow for tsmc's n6 process technology. the reference flow uses the ansys multiphysics simulation platform, including ansys raptorx, ansys exalto, ansys velocerf, and ansys totem to provide a low-risk and proven solution for designing radio-frequency chips.
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