Ansys thermal and multiphysics solutions certified for intel 18a process and 3d-ic designs

Signoff certification includes power integrity, multi-die thermal reliability, and electromagnetic modeling for ai and hpc applications / key highlights ansys redhawk-sc™ and ansys totem™ power integrity signoff platforms and ansys hfss-ic™ pro electromagnetic simulation software are certified for intel's 18a transistor process technology ansys and intel foundry deliver a thermal and multiphysics signoff flow for intel foundry's embedded multi-die interconnect bridge (emib) technology, including ansys redhawk-sc electrothermal™ signoff platform, and ansys siwave™ package electromagnetics simulation software and hfss-ic pro for signal integrity signoff and extending emib-t ansys joins the intel foundry chiplet alliance to enable an interoperable, secure ecosystem for designing multi-die heterogenous systems ansys is progressing certification for intel 18a-p and collaborating on enablement for intel 14a-e pittsburgh , april 29, 2025 /prnewswire/ -- ansys (nasdaq: anss) today announced thermal and multiphysics signoff tool certifications for designs manufactured with intel 18a process technology. these certifications help ensure functionality and reliability of advanced semiconductor systems for the most demanding applications — including ai chips, graphic processing units (gpus), and high-performance computing (hpc) products.
ANSS Ratings Summary
ANSS Quant Ranking