Ansys strengthens collaboration with tsmc on advanced node processes certification and 3d-ic multiphysics design solutions

Ai-based workflows aid advanced node designs, ensuring design and system technology co-optimization for hpc and ai applications / key highlights  tsmc and ansys advance ai-assisted workflows to support design optimization during technology node migration and photonic design optimization with tsmc's compact universal photonic engine (coupe) platform ansys redhawk-sc™ and ansys totem™ power integrity and electromigration reliability platforms and ansys redhawk-sc-electrothermal™ multiphysics platform are certified for tsmc's latest a16™ process ansys hfss-ic pro system-on-chip (soc) electromagnetic solution is certified for tsmc's 5nm and 3nm process pittsburgh , april 23, 2025 /prnewswire/ -- through continued collaboration with tsmc, ansys (nasdaq: anss) today announced enhanced ai-assisted workflows for radio frequency (rf) design migration and photonic integrated circuits (pics), and new certifications for its semiconductor solutions. together, ansys and tsmc facilitate optimized 3d integrated circuit (3d-ic) design and accelerate market readiness for ai and high-performance computing (hpc) chip applications.
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