Ansys to drive major advances in ai-powered semiconductor design using nvidia ai

Integration of nvidia modulus ai framework with the ansys seascape platform will enable engineers to easily build customized ai solutions that can improve designer productivity and quickly identify optimal design configurations / key highlights nvidia modulus artificial intelligence (ai) framework will be integrated into the ansys seascape™ cloud-optimized big data analytics platform for electronic design automation, which has demonstrated a speed-up of thermal simulation by over 100x the modulus physics-informed ai techniques strongly complement ansys multiphysics simulation engines within seascape, including ansys power integrity and reliability signoff platforms ansys redhawk-sc™, ansys totem-sc™, ansys pathfinder-sc™, and ansys redhawk-sc electrothermal™ the integration will improve product outcomes for applications including graphics processing units (gpus), high-performance computing (hpc) chips, ai chips, smartphone processors, and advanced analog integrated circuits pittsburgh , nov. 19, 2024 /prnewswire/ -- ansys (nasdaq: anss) today announced it is integrating the nvidia modulus ai framework into ansys semiconductor simulation products to deliver ai functionality that significantly speeds up design optimization. this will enable engineers to create customized and generative ai surrogate models that accelerate design iterations and explore a larger design space.
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