Tsmc recognizes ansys for excellence in design enablement for ai, hpc, and photonics silicon systems

Ansys won four tsmc 2024 oip partner of the year awards, highlighting excellence in multiphysics analysis solutions for system design using advanced silicon processes and the rapidly evolving 3d-ic and silicon photonics packaging technologies / key highlights ansys multiphysics analysis solutions are critical to the successful integration and performance of advanced multi-chip packaging and electronic and photonic co-packaged optics in tsmc's compact universal photonics engine (coupe) ansys' joint development of design solutions for tsmc's n2p and a16™ advanced silicon processes ensure power integrity, electromigration reliability, and critical thermal management for compute-heavy applications like high-performance computing (hpc) and artificial intelligence (ai) ansys collaborated on a new ai-assisted radio frequency (rf) process migration flow that automates circuit designs and improves product performance pittsburgh , oct. 25, 2024 /prnewswire/ -- ansys (nasdaq: anss) was recognized at the tsmc 2024 open innovation platform® (oip) partner of the year awards for excellence in design enablement for ai, hpc, and photonics silicon systems. the awards honor tsmc oip ecosystem partners and their contributions to innovation in next-generation 3d integrated circuit (3d-ic) design and enablement.
ANSS Ratings Summary
ANSS Quant Ranking