Faraday enhances 3d-ic design service with ansys multiphysics analysis

Ansys' certified semiconductor solutions will enable faraday to shorten design cycles of 2.5d/3d-ics and ensure designs meet signal integrity and performance goals / key highlights faraday technology corporation will use ansys raptorx™ on-chip electromagnetic (em) modeling solution to enhance the development of advanced packaging designs for 2.5d/3d integrated circuits (ics) ansys solutions will enable faraday to optimize its interposer and multi-die designs, supporting better memory bandwidth, signal integrity, and performance of end applications pittsburgh , oct. 2, 2024 /prnewswire/ -- faraday technology corporation, a leading company in the semiconductor industry, is expanding its use of ansys (nasdaq: anss) technology to enhance its capabilities in developing advanced designs for multi-die 2.5d/3d-ics — critical for artificial intelligence (ai), iot, and 5g applications. with support from ansys, faraday will empower its customers to explore more robust design options for more innovative products.
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