Tsmc expands collaboration with ansys by integrating ai technology to accelerate 3d-ic design

Ansys ai technology improves 3d-ic design productivity, while the broader collaboration advances innovative 3d-ic thermal, mechanical stress, and photonic solutions for ai, hpc, and high-speed data communication semiconductors / key highlights ansys artificial intelligence (ai)-driven solutions demonstrate higher productivity when designing components of 3d integrated circuits (ics) and provide seamless automation for critical tasks ansys multiphysics platform supports tsmc customers' reliability analysis needs for evolving 3d-ic design ansys and tsmc developed a comprehensive multiphysics analysis workflow for tsmc's compact universal photonics engine (coupe) for optical data communication pittsburgh , sept. 25, 2024 /prnewswire/ -- ansys (nasdaq: anss) and tsmc have expanded their collaboration to leverage ai for advancing 3d-ic design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies.
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